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  • Electrical and thermal connectivity enhancement,
- 07/11/2025

Cyanides and boric acid-free silver electrodeposition processes evaluation

W. Bedjou - IRT M2P, France

Previous

Surface coatings of powders, application to the electronic field with the manufacture of innovative multi-material solder balls by electroless plating.

Next

A New Hard Silver Alloy plating process for High Power connector

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